Sumitomo Bakelite introduces next generation high heat-resistant epoxy molding compound for EV power devices

Sumitomo Bakelite unveils high heat-resistant epoxy molding compound for demanding EV and power semiconductor packages

By Staff Writer, ad-hoc-news, June 16, 2026

The new high heat-resistant epoxy molding compound from Sumitomo Bakelite targets electric vehicle power modules and next-generation semiconductor packages where standard encapsulants struggle under extreme thermal and mechanical stress. It is positioned as a new release for design engineers planning upcoming platforms.

New epoxy molding compound targets hotter, smaller power modules

Engineers designing inverters, onboard chargers, and industrial drives are pushing silicon carbide and silicon power devices to higher junction temperatures while shrinking package footprints. Conventional epoxy molding compounds can crack, delaminate, or lose electrical insulation when exposed to such extreme conditions.

The new high heat-resistant epoxy molding compound from Sumitomo Bakelite is engineered to withstand elevated continuous operating temperatures, aggressive thermal cycling, and long lifetime requirements in harsh environments. The formulation aims to maintain mechanical strength, adhesion, and electrical performance even after prolonged high temperature operation.

Material design for reliability under thermal and mechanical stress

According to Sumitomo Bakelite, the compound leverages a carefully balanced epoxy resin system and inorganic fillers chosen to manage thermal expansion and heat dissipation. The objective is to reduce stress on chips, lead frames, and substrates during rapid temperature swings common in real world EV duty cycles.

By optimizing the coefficient of thermal expansion and glass transition temperature, the material seeks to minimize package warpage and internal cracking. In addition, the compound is designed to resist moisture uptake, helping to mitigate risks of corrosion and insulation breakdown in high humidity conditions often encountered in underhood environments.

Implications for EV, industrial, and renewable power applications

For electric vehicles, more reliable epoxy molding compounds can translate into fewer inverter failures, better tolerance of fast charging, and improved durability of power modules mounted close to hot engines or battery packs. Tier 1 suppliers and module makers face intense pressure to meet extended warranty periods and stringent safety standards.

In industrial automation, motor drives and power supplies operate in compact enclosures with limited cooling. A molding compound that retains insulation strength at elevated temperatures can help maintain creepage and clearance margins, especially as designers move to higher switching frequencies and compact layouts to save cabinet space.

Company background and market positioning

Sumitomo Bakelite, listed in Tokyo under ticker TSE:4203 with ISIN JP3404200003, is a long standing manufacturer of high performance plastics and semiconductor packaging materials. The company supplies epoxy molding compounds, photoresists, and related products to a wide range of electronics manufacturers worldwide.

By introducing this high heat-resistant epoxy molding compound, Sumitomo Bakelite is trying to address the growing demand for materials that enable silicon carbide based power devices and compact high voltage modules. Much of the expected growth in power electronics is driven by electrification of transport, renewable integration, and energy efficient industrial equipment.

Editorial note: This article was prepared independently by the ad-hoc-news editorial team based on publicly available information and company communications. It does not constitute investment advice or a solicitation to buy or sell any securities.