Infineon Locks In AI Power Supply Chain With Vertiv and SOLUM Pacts
Published on 11/09/2026 at 05:31 | Editorial boerse-global.de
Infineon's push into the power electronics that underpin artificial intelligence infrastructure is gathering pace on several fronts at once, with a three-year supply commitment from Vertiv and a fresh memorandum of understanding with SOLUM landing alongside a broader product offensive in automotive chips.
Vertiv confirmed on Wednesday that it has signed a strategic three-year agreement with Infineon covering the supply of power semiconductors. The deal spans components built on both silicon and silicon carbide, which are destined for use in Vertiv's 800-VDC power supply systems, among other applications.
The SOLUM arrangement, announced a day later, deepens cooperation on HVDC power supply solutions for AI data centres. According to Infineon, the collaboration will focus on DC-DC converters, battery backup units and power supplies.
New Products Target AI Servers and Telecoms
Infineon also brought its OptiMOS-7 40-V power MOSFET portfolio to market on Tuesday, aimed at AI servers, data centres and telecommunications infrastructure — several of the very end markets the company has identified for its power supply push.
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The raft of announcements comes as Infineon's shares attempt to find their footing. The stock added 1.8% on Friday to close at €45.85, stabilising after an 8.5% slide on Thursday during a sector-wide technology selloff. Reuters linked the drop to weak Qualcomm figures and fears that a Democrat-controlled US Congress could slow investment in AI infrastructure. German broadcaster Tagesschau reported on Friday that doubts over the profitability of heavy AI spending were also weighing on sentiment, pointing to concerns that tighter US regulation could hamper data centre expansion and naming Infineon among the companies affected.
GaN Bet in Villach Backed by EU Funding
On the manufacturing side, Infineon said on 27 October that it will invest around €1.1 billion at its Villach site to build high-volume production of GaN power semiconductors on 300-millimetre wafers. The project carries €319 million in support under the European Chips Act, according to the company.
Automotive work is advancing in parallel. Infineon and Qualcomm Technologies agreed on 2 November to develop a microcontroller-based subsystem for Qualcomm's Snapdragon Ride reference platforms, targeting central vehicle computers in software-defined cars as well as automated driving and digital cockpits. Infineon also unveiled the AURIX RC1, a microcontroller platform built on the open RISC-V instruction set architecture for software-defined vehicles and physical AI applications, with samples slated for the first half of 2027.
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Investors have a packed calendar ahead. Infineon will present innovative, energy-efficient solutions for an increasingly intelligent and connected world at electronica 2026 in Munich, running from 10 to 13 November in Hall C3, Stand 502. The same day the show opens, 10 November, the company will publish its results for the fourth quarter and the 2026 financial year.
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